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排序方式: 共有421条查询结果,搜索用时 375 毫秒
1.
R. Boroch J. Wiaranowski R. Mueller-Fiedler M. Ebert J. Bagdahn 《Fatigue & Fracture of Engineering Materials & Structures》2007,30(1):2-12
The aim of this work is to characterize the strength properties of polycrystalline silicon (polysilicon) with the use of tensile and bending test specimens. The strength of thin polysilicon films with different geometry, size and stress concentrations has been measured and correlated with the effective size of the specimen and its stress distribution. The test results are evaluated using a probabilistic strength approach based on the weakest link theory with the use of STAU software. The use of statistic methods of strength prediction of polysilicon test structures with a complex geometry and loading based on test values for standard material tests specimen has been evaluated. 相似文献
2.
化学沉积法制备的Ni(P)、Ni(B)纳米薄膜的结构与磁性 总被引:3,自引:0,他引:3
用化学沉积法制备了系列Ni(P),Ni(B)合金薄膜样品,用X射线衍射结构分析方法证明样品由尺寸为纳米量级的颗粒组成,样品在磁性上表现出超顺磁性,对热磁处理前后的磁学参数进行了比较研究。 相似文献
3.
Woo-Seok Cheong 《Journal of Electronic Materials》2003,32(4):249-253
For the lowest resistance, it is required to have the epitaxial silicon contact between the silicon plug and the substrate
and good step coverage at the high aspect-ratio contact holes, simultaneously. In this work, a double polysilicon (DPS) deposition
technique was proposed for the requirements. The first, thin silicon layer is deposited in a single-wafer process chamber
with an in-situ H2-RTP (rapid thermal process) treatment for the epitaxial contact, and the second silicon layer is formed in a batch-type furnace
for good step coverage. From chain resistance, Kelvin Rc, and current-voltage (I–V) measurement, the DPS process meets both low resistance and good uniformity, so that it suggests
a breakthrough in the small-sized, semiconductor device application. 相似文献
4.
5.
利用低压化学气相淀积法(LPCVD)在表面有热氧化二氧化硅的(100)硅衬底上生长80nm厚多晶硅纳米膜,并对其界面进行表征.制作出单层Al金属的欧姆接触样品,在不同退火温度条件下对样片的电阻进行测量.结果表明,退火使欧姆接触的电阻率降低,接触电阻率可达到2.41×10-3Ω.cm2. 相似文献
6.
用化学沉淀法制备了纳米薄膜Ni100-XPX(X=2.40,2.89,3.21,3.60,4.64,5.45,7.64)系列样品。用Scherrer法计算出组成薄膜的颗粒的尺寸为7~15nm。利用振动样品磁强计测量了材料的磁学参数。对晶格常数、饱和磁化强度、居里温度与磷含量的关系进行了详细的分析。 相似文献
7.
8.
Tzu‐Ming Wang Yu‐Hsuan Li Ming‐Dou Ker 《Journal of the Society for Information Display》2009,17(10):785-794
Abstract— Low‐temperature polysilicon (LTPS) technology has a tendency towards integrating all circuits on glass substrate. However, the poly‐Si TFTs suffered poor uniformity with large variations in the device characteristics due to a narrow laser process window for producing large‐grained poly‐Si TFTs. The device variation is a serious problem for circuit realization on the LCD panel, so how to design reliable on‐panel circuits is a challenge for system‐on‐panel (SOP) applications. In this work, a 6‐bit R‐string digital‐to‐analog converter (DAC) with gamma correction on glass substrate for TFT‐panel applications is proposed. The proposed circuit, which is composed of a folded R‐string circuit, a segmented digital decoder, and reordering of the decoding circuit, has been designed and fabricated in a 3‐μm LTPS technology. The area of the new proposed DAC circuit is effectively reduced to about one‐sixth compared to that of the conventional circuit for the same LTPS process. 相似文献
9.
10.
Szu‐Han Chen Ming‐Dou Ker Tzu‐Ming Wang 《Journal of the Society for Information Display》2011,19(8):539-546
Abstract— A digital time‐modulation pixel memory circuit on glass substrate has been designed and verified for a 3‐μm low‐temperature polysilicon (LTPS) technology. From the experimental results, the proposed circuit can generate 4‐bit digital codes and the corresponding inversion data with a time‐modulation technique. While the liquid‐crystal‐display (LCD) panel operates in the still mode, which means the same image is displayed on the panel, a data driver for an LCD panel is not required to provide the image data of the frame by the proposed pixel memory circuit. This pixel memory circuit can store the frame data and generate its corresponding inversion data to refresh a static image without activating the data driver circuit. Therefore, the power consumption of a data driver can be reduced in the LCD panel. 相似文献